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packaging paste for semiconductor
Electronic Components
Photovoltaics Packaging
Semiconductors
packaging paste for semiconductor
Specialty Pastes
Die Attach Paste
HS-411 silver paste is designed for chip (such as LED/IC) packaging.
Learn more+
Nano-Sintered Materials
HS-401 is a nano sintered silver paste. It can be used for high power modules (such as IGBT) packaging. It has high thermal conductivity, high electrical conductivity and high reliability.
Learn more+
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Address:No.13, Riyue North Second Road, Qidingshan Street, Jinzhou District, Dalian City, Liaoning Province, China
Email Address:hs-tech@huashengchn.com
Contact person:Mr Ji
Phone:+86-411-39554099
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